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I/O Module is based on Xilinx FPGA.

2012-05-15 14:31:39| Industrial Newsroom - All News for Today

ChipVORX® Module(TM) is controlled via standard TAP, enabling access to entire ChipVORX test and programming IPs for external instrumentation. Model FXT-X90, based on Xilinx FPGA, provides 90 I/O channels, 72 of which are voltage programmable. With transparent TAP, module enables daisy-chained cascading of several same or different boards types. Functions for universal frequency measurement, RAM test, Flash programming, or control of customer-specific instruments are provided as ChipVORX® IP. This story is related to the following:Test and Measuring InstrumentsSearch for suppliers of: I/O Modules

Tags: based module fpga xilinx

Digital Signage Module complies with Intel® OPS standard.

2012-05-15 14:31:36| Industrial Newsroom - All News for Today

Designed to be installed into any Intel® OPS compliant digital signage platform, Model OPM-CDV is powered by 1.86 GHz Intel® Cedarview N2800 Dual-Core processor and Intel® NM10 Express Chipset, which supports onboard 1 GB DDR3 1066 system memory. Unit uses EQM-CDV Qseven module and EAP-OPI Qseven carrier board. Measuring 200 x 119 x 30 mm, module offers variety of I/O, including 1 COM port, 2 USB 2.0 ports, 1 HDMI, 1 Mini-PCIe slot, and 1 Intel® 82574L Gigabit LAN. This story is related to the following:Computer Hardware and PeripheralsSearch for suppliers of: Embedded Computers

Tags: standard digital module ops

Wi-Fi/Bluetooth Module has compact form factor.

2012-05-11 14:29:23| Industrial Newsroom - All News for Today

Type TN module (Part No. LBEE5ZSTNC-523) offers 802.11b/g/n Wi-Fi and Bluetooth v4, including Bluetooth low energy, in 17.0 x 10.0 x 2.2 mm package. Powered by Texas Instruments WL1271L chipset, module is wireless connectivity solution within TI AM335x microprocessor development platform and FCC-/IC-certified on Com6M daughter card. Additional development platforms compatible to plug-in Com6M are OMAP4 based Blaze platforms and DM814x/AM387x platforms. This story is related to the following:Communication Systems and Equipment Sponsored by: Mini-Circuits - PNANewsletter AdSearch for suppliers of: Bluetooth™ Modules

Tags: form factor module compact

Infineon, Fuji agree on HybridPACK 2 automotive power module specs

2012-05-11 01:58:16| Semiconductors - Topix.net

Fuji Electric and chip manufacturer Infineon Technologies agreed to extend the supplier base for power modules deployed in automotive hybrid and electrical vehicles .

Tags: power agree automotive module