Home › Tencent raises USD 6 bln in bond offering, pledges investment of USD 70 bln into cloud, AI, cybersecurity
 

Keywords :   


Tencent raises USD 6 bln in bond offering, pledges investment of USD 70 bln into cloud, AI, cybersecurity

2020-05-29 15:43:00| Telecompaper Headlines

(Telecompaper) The company has pledged to invest USD 70 billion into new infrastructure over the coming five years, Reuters noted, citing a statement to state media by company SVP Dowson Tong. The money will go into cloud computing, artificial intelligence and cybersecurity, and namely in blockchain, servers, big data centres, supercomputer centres, IoT operating systems, 5G networks and quantum computing.

Tags: investment offering usd bond

Category:Telecommunications

Latest from this category

All news
20.01Redefining Detection Engineering and Threat Hunting with RAIDER
Telecommunications »
29.01Millions to get 150 off energy bills for further five years
29.01Millions to get 150 off energy bills for further five years
29.01Apple reports best-ever iPhone sales as Mac dips
29.01Venezuelan MPs approve bill to open up oil sector to private firms
29.01Planning bids for new homes rise in England but building remains low, data suggests
29.01H5N1 Risk to Swine Research Program seeks 2nd round of proposals
29.01Pig breeder Muyuan Foods seeks up to $1.4 Billion in Hong Kong listing
29.01duBreton responds to Canada's approval of the PRRS-resistant pig
More »